Smart Photonics
We are very pleased to announce that imec and SMART Photonics signed a Memorandum Of Understanding (MOU) to underpin their intention to work together in the field of hybrid integration of InP on SiN/SiPh.
This collaborative work will include topics like:
– Hybrid integration of InP on SiN/SiPh with Flip chip bonding and butt coupling
– Hybrid integration of InP on SiN/SiPh with micro-transfer printing
– Component design i.e. laser design and design of interface elements for the integration of InP/SiPh along with system demonstration and prototyping.
Via this cooperation IMEC and SMART Photonics intend to accelerate adoption and market pull of hybrid integrated solutions for domains such as datacom, automotive, agrifood and health.
Het bericht imec and SMART Photonics sign Memorandum Of Understanding verscheen eerst op SMART Photonics.
